ALPHA EF-6103: Alcohol-Based Flux for High-Reliability Wave Soldering
The ALPHA EF-6103 flux is a high-performance alcohol-based soldering flux specially developed to ensure optimum solderability and high reliability in modern soldering processes. Designed for high-density printed circuit boards, as well as standard or thick boards, it is fully compatible with lead-free processes (standard SAC and low-silver SAC alloys) and eutectic SnPb alloys.
Its advanced formulation effectively reduces the risk of bridging on the underside of QFPs, while providing excellent hole filling and consistent solder-ball performance. The ALPHA EF-6103 also provides excellent adhesion of lead-free solder joints, with a uniform, dry, non-tacky residue, making quality inspection easier and keeping assemblies clean.
Thanks to its balanced composition, this flux helps maximize solder-joint quality while ensuring full compatibility with pin testing and high-speed automated processes. It is the preferred solution for production environments requiring stable, long-lasting soldering performance.
ALPHA 3355-TF is a VOC-free, water-soluble flux formulated to reduce VOC emissions while providing exceptional solder wetting across a wide range of metal surfaces.
ALPHA 3355-VF is a VOC-free, water-soluble flux formulated to reduce VOC emissions while providing exceptional solder wetting across a wide range of metal surfaces.
ALPHA 856 is an intermediate-activity, water-soluble resin flux with no organic acid activators. It can be cleaned effectively with plain water to achieve very low ionic contamination levels.
ALPHA EF-8800HF is a medium-solids, alcohol-based flux designed for standard and thicker high-density printed circuit boards in both leaded and lead-free processes.
ALPHA EF-Series is a medium-solids, alcohol-based flux designed for standard and thicker high-density printed circuit boards in both leaded and lead-free processes.
ALPHA 856 is formulated for flawless soldering in water-cleaning processes. It features a buffered activation system with no free acid and a neutral pH. Its post-solder residues are non-acidic.
