Alpha OM-362
ALPHA OM-362: Lead-Free Solder Paste with Ultra-Low Voiding
The ALPHA OM-362 is an lead-free, halogen-free, no-clean solder paste, available in T4, developed to deliver exceptional solder-joint quality with ultra-low voiding.
Designed for applications requiring high reliability and optimal assembly quality, it provides:
An IPC Class III voiding level on BGA,
An average voiding below 10% on bottom-terminated components (BTC).
Thanks to its advanced flux chemistry, ALPHA OM-362 provides uniform wetting and outstanding process stability, even on high-density boards. It is fully compatible with high-reliability alloys, including Innolot® and conventional SAC alloys, meeting the requirements of the automotive, industrial and consumer-electronics sectors.
This solder paste is an ideal solution for manufacturers seeking reliable, clean, high-performance solder joints while complying with the strictest environmental standards.
View the ALPHA OM-362 technical datasheet on the Alpha Assembly Solutions website
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