ALPHA OM-535
ALPHA OM-535: Low-Temperature, High-Performance Solder Paste
The ALPHA OM-535 was developed to improve solder-joint performance in both drop-shock resistance and thermal durability, outperforming traditional low-temperature products on the market.
By combining the SBX02 low-temperature alloy with the advanced chemistry of the paste, it enables the formation of mechanically strong solder joints, attractive and reliable, while maintaining low-temperature process parameters, helping protect heat-sensitive components.
Designed to meet the requirements of the modern electronics industry, ALPHA® OM-535 is an no-clean, lead-free, halogen-free solder paste, Type 4, offering:
An enhanced thermal cycling capability
An excellent level of drop-shock resistance
An optimal low-temperature solder-joint quality
This technology is an ideal solution for applications requiring high soldering performance while reducing thermal stress on circuit boards and components.
Learn more about ALPHA OM-535 on the Alpha Assembly Solutions website
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