ALPHA EF-Series Liquid Soldering Flux

ALPHA EF-Series Liquid Soldering flux was specially developed to provide an exceptional board appearance and eliminate the risk of solder balls and bridging, two defects commonly associated with wave soldering. Among all low-solids no-clean fluxes (< 4% solids), it has the lowest tendency to form solder balls across a wide variety of solder masks during wave and selective soldering. ALPHA EF-Series Liquid Soldering is recommended for assemblers whose boards are prone to bridging, who perform pin testing, or whose specifications require an extremely low incidence of solder balls.

EF-Series Liquid Soldering is an active, low-solids, no-clean flux. Designed for a wide temperature range, it delivers optimum productivity for lead-free wave-soldering applications and is also an excellent choice for remaining tin-lead production lines. Its formula contains a proprietary blend of organic activators.