Colle CMS 10 CC

SMT Adhesive 10 cc

The Epibond® 7275 series offers premium surface-mount adhesives engineered to securely hold components in place during wave soldering. With excellent dot consistency and rapid curing, these adhesives deliver precise, reliable placement without sagging or stringing. Suitable for dot dispensing, printing, or pin transfer, Epibond® ensures superior assembly quality and performance.

Epibond® Surface Mount Adhesives Typical Cure Profile:

A correct thermal profile is essential to ensure maximum mechanical strength and uniform adhesive curing:

Ensure the material is heated to the correct temperature for the specified duration.
The maximum temperature ramp rate is 1.5 to 2.0 °C per second to ensure uniform curing.

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