HTCPX

HTCPX is a premium, non-curing thermal paste engineered to deliver exceptional thermal conductivity while filling gaps between components. It is ideal for efficient and reliable heat dissipation or thermal coupling where silicones are prohibited, eliminating the risk of silicone or low-molecular-weight siloxane migration.

FEATURES AND BENEFITS:

Exceptionally high thermal conductivity; promotes rapid heat dissipation across uneven surfaces.
Very high viscosity, providing vibration stability; ideal for use as a gap-filling material.
Silicone-free oil base; prevents silicone and low-molecular-weight siloxane migration issues.
Non-curing paste; allows simple and effective component rework when required.

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Storage:

Component Management

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