ALPHA OM-565

ALPHA OM-565: Low-Temperature Solder Paste for Heat-Sensitive Applications

The ALPHA OM-565 HRL3 is an low-temperature solder paste specially developed to reduce warpage defects and improve solder-joint quality on heat-sensitive chip packages.

Thanks to its advanced chemical formulation, it supports peak reflow temperatures of 175 °C, protecting heat-sensitive components while ensuring exceptional wetting. This performance effectively limits post-reflow defects, including:

• The Non-Wet-Open (NWO) defects

• The Head-In-Pillow (HIP) defects

The innovative chemistry of ALPHA OM-565 also provides enhanced electrochemical stability compared with existing low-melting-point solders. It is fully compatible with other ALPHA solutions designed for contact-rework applications, providing maximum flexibility for advanced manufacturing processes.

View the ALPHA OM-565 technical datasheet on the Alpha Assembly Solutions website