ALPHA Solder

ALPHA OM-338: Lead-Free Solder Paste for High-Density Applications

The ALPHA OM-338 is an lead-free, no-clean solder paste, designed to deliver performance comparable to tin-lead processes while ensuring broad compatibility with modern electronics applications.

Its wide reflow process window helps minimize transition issues between tin-lead and lead-free solder paste, ensuring reliable, uniform soldering on different board types, including CuOSP.

ALPHA OM-338 provides:

• Excellent ultra-fine repeatability (11 mil squares)

• High performance in high-throughput applications

• Optimal coalescence across a wide range of deposit sizes

• Exceptional resistance to random solder balls

• Excellent mid-chip solder-ball performance