Mini-Wave
Mini-Wave
An alloy is placed in the tank, melted, discharged through the nozzle, and formed into an extremely smooth wave. This process allows components to be soldered or desoldered without affecting or damaging neighboring components and maintains a solder surface free of impurities at all times. Mini-wave systems are also production machines for soldering complex components using suitable multi-jet nozzles.
Technical Specifications:
Power supply:230 V / 50-60 Hz
Power: 1 350 W
Solder capacity:1,3 kg
Dimensions: 370 x 240 x 280 mm
Alloy capacity: 12kg
Maximum PCB dimensions:160 x 500 mm
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Our rotary solder pots keep the solder surface consistently clean and bright. The crucible rotates against a fixed scraper blade, which collects and removes dross.
Static solder pots are generally used for tinning, gold removal, or enamel stripping. Some pots can be equipped with a manual pantograph for batch component tinning or with automatic systems.
This unit was developed to recover the dross that inevitably forms when wave soldering machines are used with leaded or lead-free alloys.