Alpha CVP-520

TheALPHA CVP-520 is specifically engineered for low-temperature, quasi-eutectic alloys such as SnBi0.4Ag, enabling advanced reflow profiles between 155 °C and 190 °C. Its transparent, colorless flux residue provides excellent electrochemical reliability. The carefully selected alloy used in ALPHA CVP-520 provides the lowest melting point and tightest viscosity range during melting and resolidification, maximizing thermal-cycle fatigue resistance in traditional low-temperature alloy applications. It also produces extremely low voiding in BGA solder joints, even with standard SAC alloy spheres. All components used with SnBi solders must be lead-free to prevent tin/lead/bismuth intermetallics with melting points below 100 °C. For more information, visit the official MacDermid Alpha Electronics Solutions