Multi-Layer (Step Stencil)

Using innovative laser soldering technology, ADELEC offers multi-layer stencils that ensure perfect solder paste deposition, even in the most demanding areas of your printed circuit boards.
This technology involves welding materials of varying thickness onto a base surface.

Step-Up : Optimize solder paste deposits with raised areas tailored to your most demanding components.
Ideal for pin-in-paste technology and large components, these raised areas ensure uniform application even when coplanarity issues occur.

Step-Down : Controlled deposits for the most delicate components.
Recessed areas allow you to precisely reduce solder paste volume, while maintaining optimal repeatability for fine-pitch and micro-package components.
With this technology, you achieve consistent deposit quality, even in the most sensitive areas of your PCB.