Zenith LiTE
Zenith LiTE
Zenith LiTE’s patented 3D AOI system efficiently measures true profilometric component shapes, foreign materials, patterns and solder joints on assembled PCBs, overcoming the vulnerabilities and limitations of 2D AOI.
Discover Zenith LiTE with multiple resolutions and configurable options to meet application needs.
True, flawless 3D inspection performance
ZENITH LiTE makes clear, concise pass/fail decisions for solder-joint inspection by detecting a wide range of potential defects including insufficient solder, offset, rotation, polarity, flipped components, OCV/OCR issues, solder fillets, display defects, lifted leads, lifted bodies, tombstoning, bridging and more.
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