ALPHA OM-372

ALPHA OM-372: Solder Paste for Ultra-Fine, High-Density Components

The ALPHA OM-372 is an lead-free, no-clean solder paste designed to provide ultra-high electrochemical reliability on fine-pitch components with tight solder spacing. Its advanced formulation provides:

• An extremely low level of post-reflow residue

• An accurate level of process control with transfer efficiency above 1.66 Cpk on fine-feature pads down to 80 × 130 µm (008004)

• Strong performance against HiP (Head-in-Pillow) and NWO (Non-Wet-Open)

The ALPHA OM-372 is ideally suited to high-density board applications requiring smaller, finer and lighter components. It provides excellent stencil transfer efficiency, a high electrical reliability and superior solder-joint quality on ultra-fine assemblies.

For optimal performance, this paste requires nitrogen reflow and is available in Type 5 and Type 6 powders, meeting the needs of advanced production processes and complex electronic assemblies.