ALPHA OM-550

ALPHA OM-550: High-Performance, Low-Temperature Solder Paste with HRL1 Alloy

The ALPHA OM-550 represents a major advancement in low-temperature soldering. This innovative product combines advanced chemistry with theHRL1 alloy and is specifically engineered to provide superior drop-shock resistance and thermal-cycle durability compared with traditional low-temperature alloys.

Thanks to its optimized formulation, OM-550 offers all the features of a modern solder paste used for complex motherboards, while maintaining low-temperature reflow capability. This helps minimize NWO (Non-Wet-Open) defects and HIP (Head-in-Pillow), ensuring consistent and reliable solder-joint quality.

All components used with ALPHA OM-550 must be lead-free, to prevent tin/lead/bismuth intermetallics with melting points below 100 °C and ensure thermal stability and enhanced reliability.

ALPHA OM-550 is ideal for heat-sensitive electronics applications, including motherboards, embedded systems and devices requiring precision soldering.

View the ALPHA OM-550 technical datasheet on the Alpha Assembly Solutions website